A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications uri icon

Overview

publication date

  • October 1, 2009

has restriction

  • closed

Date in CU Experts

  • January 20, 2017 1:02 AM

Full Author List

  • Geng F; Ding X-Y; Xu G-W; Luo L

author count

  • 4

Other Profiles

International Standard Serial Number (ISSN)

  • 0960-1317

Electronic International Standard Serial Number (EISSN)

  • 1361-6439

Additional Document Info

start page

  • 105011

end page

  • 105011

volume

  • 19

issue

  • 10