A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications Journal Article uri icon

Overview

publication date

  • October 1, 2009

Full Author List

  • Geng F; Ding X-Y; Xu G-W; Luo L

Other Profiles

Additional Document Info

start page

  • 105011

end page

  • 105011

volume

  • 19

issue

  • 10