Thermal Design, Optimization, and Packaging of Planar Magnetic Components Journal Article uri icon

Overview

publication date

  • September 1, 2021

has restriction

  • hybrid

Date in CU Experts

  • September 20, 2021 4:46 AM

Full Author List

  • Dede EM; Gao Y; Zhou Y; Sankaranarayanan V; Zhou F; Maksimovic D; Erickson RW

author count

  • 7

citation count

  • 6

Other Profiles

International Standard Serial Number (ISSN)

  • 2156-3950

Electronic International Standard Serial Number (EISSN)

  • 2156-3985

Additional Document Info

start page

  • 1480

end page

  • 1488

volume

  • 11

issue

  • 9