A Dual-Cure, Solid-State Photoresist Combining a Thermoreversible Diels-Alder Network and a Chain Growth Acrylate Network Journal Article uri icon

Overview

publication date

  • May 27, 2014

Date in CU Experts

  • July 25, 2014 1:29 AM

Full Author List

  • Berg GJ; Gong T; Fenoli CR; Bowman CN

author count

  • 4

citation count

  • 30

Other Profiles

International Standard Serial Number (ISSN)

  • 0024-9297

Electronic International Standard Serial Number (EISSN)

  • 1520-5835

Additional Document Info

start page

  • 3473

end page

  • 3482

volume

  • 47

issue

  • 10